Wednesday, 11 December 2013

Apalis – A New Architecture for Embedded Computing

The complexity of today's embedded systems creates many challenges for engineers and project managers. The use of off-the-shelf computer on modules tremendously eases this situation. Computer-On-Modules (COMs) encapsulate the ever increasing complexity of modern hardware and software technologies, creating a single subsystem which can be easily integrated as a core component of an embedded product. This has the benefit of massively shortening the time to market while at the same time drastically reducing product development risk. The deployment of an off the shelf System on Module family decouples the customer from the underlying silicon vendors, greatly extending product lifecycle while reducing total cost of ownership.



 
Toradex presents the new Apalis Computer-On-Module family enabling customers to take full advantage of the latest advancement in technologies, making it possible to create leading edge products and user experiences for the embedded market.

The features and interfaces of Apalis™ are described, including specific value propositions like Direct Breakout™ and MXM SnapLock™.

Wednesday, 20 November 2013

Apalis T30 Computer Module - Hardware

The Apalis T30 is a computer module based on the NVIDIA© Tegra 3 embedded System-on-Chip (SoC). The Cortex A9 quad core CPU peaks up to 1.4 GHz Single Core / 1.3 GHz Quad Core. This System on Module delivers very high CPU and graphic performance with minimum power consumption. 

The Apalis T30 incorporates DVFS (Dynamic Voltage and Frequency Switching) and Thermal Throttling which enables the system to continuously adjust operating frequency and voltage in response to changes in workload and temperature to achieve the best performance with the lowest power consumption. 

The integrated NVIDIA Graphics enables visually rich, smooth and fast user interfaces. 

The module targets a wide range of applications, including: Digital Signage, Medical Devices, Navigation, Industrial Automation, HMIs, Avionics, Entertainment System, POS, Data Acquisition, Thin Clients, Robotics, Gaming and much more

It offers a wide range of interfaces from simple GPIOs, industry standard I2C and SPI buses through to high speed USB 2.0 interfaces and high speed PCI Express and SATA. The HDMI and dual channel LVDS interfaces make it very easy to connect large, full HD and beyond resolution displays. 

The Apalis T30 ARM Computer module encapsulates the complexity associated with modern day electronic design, such as high speed impedance controlled layouts with high component density utilising blind and buried via technology. This allows the customer to create a carrier board which implements the application specific electronics which is generally much less complicated. The Apalis T30 module takes this one step further and implements an interface pin out which allows direct connection of real world I/O ports without needing to cross traces or traverse layers, referred to as Direct Breakout™. This becomes increasingly important for customers as more interfaces move toward high speed, serial technologies that use impedance controlled differential pairs, as it allows them to easily route such interfaces to common connectors in a simple, robust fashion.

Thursday, 14 February 2013

The Need for an New Standard for Embedded Systems

There has been dramatic growth in products using ARM™ processors, driven most recently by the expanding smartphone and tablet markets. ARM based solutions are appearing in areas previously reserved for high power x86 based solutions. At the same time, the likes of Intel® and AMD are trying to increase power efficiency in their x86 products in order to compete in areas previously dominated by ARM.

The gradual integration of interfaces such as PCI-Express, Gigabit Ethernet, SATA and HDMI into the latest SoCs and APs have driven the need for a new computer on module standard. These interfaces are enabling ARM devices to enter application areas such as digital signage and high-end multimedia, previously reserved for higher power, x86 based platforms.

Leveraging the decades of man years of expertise of Toradex in the embedded ARM market, Toradex has created the new System on module standard, called Apalis™.

Friday, 25 January 2013

Apalis™: Expanding the Reach of ARM in Embedded Systems

The future proof Apalis computer on module family architecture has been developed based on research into different technologies and in close collaboration with our customers.

The main objectives for the Apalis architecture are as follows:

• Longevity: Apalis is architected with a very long-term lifecycle in mind, not being design around a specific SoC or AP. This decouples Apalis from individual SoC vendors and therefore provides extended lifecycle (10+ years) required for embedded products.

• Extensibility: A wide range of easily configurable interface options supports an almost unlimited variety of product applications. Provision to support as yet unknown interfaces ensures Apalis is ready for next generation connectivity and interface technologies.

• Usability: Complexity is encapsulated on the Apalis Computer module, greatly reducing design complexity for customers. Apalis goes much further than any other COM standard, allowing all high speed signals to be routed to real world connector on a single PCB layer.

• Compatibility: Apalis provides full support for 3.3V voltage level on all GPIOs and industrial standard interfaces, a requirement for many embedded applications.

• Simplicity: Specific focus was put on simplifying power management. Reducing the number of voltage rails and power management signals required greatly helps to reduce design complexity, development time and total cost of the entire system.